French Embassy in Uganda Opens Applications for 2026–2027 Local Scholarships for French Language Studies ·French Embassy in Uganda

Overview

This program offers financial support to outstanding Ugandan students pursuing a Bachelor’s degree in French Language Studies at recognized universities in Uganda.

Eligibility

This scholarship is aimed at motivated students who demonstrate both academic merit and financial need.

Benefits

By providing financial assistance, the programme aims to reduce financial barriers to higher education while encouraging the development of skilled graduates with strong French language proficiency.

How to Apply

Applicants will be required to provide personal and academic information through the official application form. Required information includes:

• Full name as it appears on the National Identification Card.
• Email address.
• Telephone number.
• Date of birth.
• Intended bachelor’s degree title.
• Name of the recognized Ugandan university where admission has been sought.
• Full Advanced Level (A-Level) subject combination.
• Year of A-Level completion.
• Current status (Student, Employed, Unemployed, Other).

Supporting documents must be uploaded as one PDF file named using the format: Name-Surname_2026_Licence.pdf. The application package should include:

• A copy of a valid Ugandan National Identification Card.
• A recommendation letter (optional but strongly encouraged).
• A motivation or cover letter of no more than one page explaining interest in studying French, career aspirations, and how the scholarship supports long-term goals.
• A copy of the Uganda Advanced Level Certificate or equivalent qualification.
• A curriculum vitae not exceeding one page.
• Documents demonstrating financial need, which may include previous scholarship records, payslips, personal bank statements, and parents’ or guardians’ financial documents.

Applicants who have not yet received admission to a recognized Ugandan university may submit their Letter of Admission later, once it becomes available.

Deadline

Applications must be submitted by 15 July 2026.